Vapor Chamber Technology: Alienware's new vapor chamber technology uses advanced methods for efficient heat dissipation. The new Alienware m17 is designed with a dedicated vapor chamber between the CPU and copper heat pipes. All of these are designed to manage heat flow and maximize performance. These chambers use the phase change nature of the liquid to transfer heat more effectively than a solid piece of metal or copper heat pipes. Vapor chambers are also more versatile than copper heat pipes because they can be designed to be evenly distributed over an entire chip to be cooled.
Dual-intake, dual-exhaust airflow design: Our thin and light chassis prioritizes performance, with a dual-fan design that takes air from the top and bottom slots and exhausts it through the rear and side slots for optimal cooling of the main components.
High-voltage powered fan: the fire-resistant, Kevlar-like liquid crystal polymer fan blades have ring bearings and three-phase control, to create less friction and drive air more efficiently. Currently, there are 132 unique fan blades to cool both the CPU and GPU.
Heat pipes that balance the load: the dynamics of the thermal activity in the main components such as the graphics processor and the central processor is carried out intelligently by four 3.5 mm copper-composite heat pipes.
Dense Copper Lamellar Heatsink: The new m17 has the largest amount of copper material, by weight, dedicated to providing heat dissipation for the core components, compared to the previous m17. The new m17 has also increased the size of the heat pipes by 40%, to increase the overall surface area and heat dissipation.